Digitalization & Sustainability Review

Peer Reviewed Article

Vol. 1 No. 1 (2021)

Innovations in PCB Design: The Role of Advanced Circuit Simulation Techniques

Submitted
25 March 2021
Published
05-05-2021

Abstract

This study aims to determine how advanced circuit simulation techniques can improve PCB design by cutting costs and development time while increasing design accuracy, efficiency, and reliability. The study synthesizes information from peer-reviewed journals, industry reports, and technical papers using a secondary data-based review process. Key conclusions show that sophisticated simulation techniques, such as signal integrity, power integrity, thermal, and SPICE simulations, significantly increase design accuracy and expedite the prototype process. These methods assist complex high-density designs, enhance performance for high-frequency applications, and allow for the quick discovery of design defects. PCB design is about to undergo another revolution because of emerging trends like wearable technology, 3D printing, new materials like graphene, and the integration of AI and ML. Policy implications indicate that sustaining competitive advantage and fostering innovation in the electronics sector need investing in and using these cutting-edge simulation approaches. These tools will be increasingly necessary for managing complexity and fulfilling strict performance and reliability requirements as electronic devices develop, ultimately setting new standards for PCB design.

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